Join us for the Technical Workshop in Berlin, Germany!

 

Direct Write Technology in Industrial R&D, Electronics System Integration, and Packaging


Jointly presented by:


Explore the advances in maskless lithography and related systems and solutions tailored for industrial R&D, electronics system integration and packaging. 

Join the technical workshop on direct write technology jointly organized by Heidelberg Instruments and the Fraunhofer Institute for Reliability and Microintegration (IZM) ahead of the 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) taking place in Berlin from September 11-13, 2024. Get insights while users are sharing their projects realized with direct writers and maskless aligners.

When: Tuesday, Sept. 10, 2024, 13:30 - approx. 16:30 (CEST)

Where: Mercure Hotel MOA, Berlin, Germany

Costs: Free of charge (prior registration required)

Coffee, drinks, and snacks will be provided.

After the technical workshop program, participants will have the opportunity to join a guided tour of the cleanroom facilities at Fraunhofer IZM. Participation is limited and will be offered on a first-come, first-served basis. Bus transfer from and back to the conference venue will be provided.

 

Agenda

13:30

Welcome and Introduction
Markus Wöhrmann, Fraunhofer Institute for Reliability and Microintegration IZM, Berlin, Germany & Wolfgang Meixner, Heidelberg Instruments Mikrotechnik, Heidelberg, Germany

13:40

Maskless Aligner Use in an University Research and Pilot Line Environment
Robert Naujokaitis, Arizona State University, Phoenix, AZ, USA

14:05

Hybrid System-in-Foil Integration Through Direct Laser Writing
IMS Chips, Michael Kübler, Stuttgart, Germany

14:30

Adaptive Lithography with Industrial Scale Maskless Aligners
Daniel Heimfahrth, Heidelberg Instruments Mikrotechnik GmbH, Heidelberg, Germany

14:55

Coffee Break and Networking

15:15

Enhancing Laser Lithography by Proximity and Process Correction Software
Jörg Günther / Nezih Ünal, GenISys GmbH, Taufkirchen, Germany

15:40

Challenges for Lithography in Advanced Packaging
Markus Wöhrmann, Head of Lithography and Thin Film Polymers Group

16:30

Summary, End of Technical Programm
Bus transfer to Fraunhofer IZM

17:00 - 18:30

Cleanroom Tour
Fraunhofer IZM (3-4 groups | first-come, first-served basis)
     
Bus transfer to Mercure Hotel MOA                                     

Register here!