Join us for the Technical Workshop in Berlin, Germany!

 

Direct Write Technology in Industrial R&D, Electronics System Integration, and Packaging


Jointly presented by:


Explore the advances in maskless lithography and related systems and solutions tailored for industrial R&D, electronics system integration, and packaging. 

Join the technical workshop on direct write technology jointly organized by Heidelberg Instruments and the Fraunhofer Institute for Reliability and Microintegration (IZM) ahead of the 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) taking place in Berlin from September 11 to 13, 2024. Discover real-world applications of maskless lithography and get insights from industry on its potential.

When: Tuesday, Sept. 10, 2024, 13:30 - approx. 16:30 (CEST)

Where: Mercure Hotel MOA, Berlin, Germany, Room 14 (MOA 14)

Costs: Free of charge (prior registration required)

Coffee, drinks, and snacks will be provided.

Before the workshop, we invite you to a lunch get-together at 12:30 PM in the restaurant of the Mercure Hotel MOA Berlin.

After the technical workshop program, participants will have the opportunity to join a guided tour of the cleanroom facilities at Fraunhofer IZM. Participation is limited and will be offered on a first-come, first-served basis. Bus transfer to Fraunhofer IZM and back to the conference venue will be organized.

 

Agenda

13:30

Welcome and Introduction
Markus Wöhrmann, Fraunhofer Institute for Reliability and Microintegration IZM, Berlin, Germany & Wolfgang Meixner, Heidelberg Instruments Mikrotechnik, Heidelberg, Germany

13:40

Hybrid System-in-Foil Integration Through Direct Laser Writing
Michael Kübler, IMS Chips, Stuttgart, Germany

14:05

Maskless Aligner Use in a University Research and Pilot Line Environment
Rob Naujokaitis, Arizona State University, Phoenix, AZ, USA

14:30

Adaptive Lithography with Industrial Scale Maskless Aligners
Daniel Heimfarth, Heidelberg Instruments Mikrotechnik GmbH, Heidelberg, Germany

14:55

Coffee Break and Networking

15:15

Enhancing Laser Lithography by Proximity and Process Correction Software
Jörg Günther / Nezih Ünal, GenISys GmbH, Taufkirchen, Germany

15:40

Challenges for Lithography in Advanced Packaging
Markus Wöhrmann, Head of Lithography and Thin Film Polymers Group

16:30

Summary, End of Technical Programm
Bus transfer to Fraunhofer IZM

17:00 - 18:30

Cleanroom Tour
Fraunhofer IZM (3-4 groups | first-come, first-served basis)     
Bus transfer to Mercure Hotel MOA                                     

Register here!